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Handbook of Lapping and Polishing (Manufacturing Engineering and Materials Processing)

Handbook of Lapping and Polishing (Manufacturing Engineering and Materials Processing)
Creators: Ioan D. Marinescu, Eckart Uhlmann, Toshiro Doi
Publisher: CRC
Category: Book

List Price: $149.95
Buy New: $126.50
You Save: $23.45 (16%)



New (12) Used (5) from $110.00

Sales Rank: 200208

Media: Hardcover
Edition: 1
Number Of Items: 1
Pages: 512
Shipping Weight (lbs): 1.7
Dimensions (in): 8.9 x 6.3 x 1.3

ISBN: 1574446703
Dewey Decimal Number: 671.35
EAN: 9781574446708
ASIN: 1574446703

Publication Date: November 20, 2006
Availability: Usually ships in 1-2 business days
Condition: Absolutely Brand New & In Stock. 100% 30-Day Money Back. Direct from our warehouse. Ships by USPS. 1+ million customers served-In business since 1986. Happy Customers is Our #1 Goal. Toll Free Support

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  • Handbook of Machining with Grinding Wheels (Manufacturing Engineering and Materials Processing)
  • Handbook of Ceramics Grinding and Polishing: Properties, Processes, Technology, Tools and Typology (Materials Science and Process Technology Series)

Editorial Reviews:

Product Description
Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice. Collecting decisive work contributed by industrial and academic experts from the USA, Germany, and Japan, this authoritative resource presents the latest lapping and polishing technologies along with case studies that illustrate their value. After a brief introduction, the book explains the fundamental concepts and major types of lapping and polishing processes. The discussion then turns to lapping of ductile and brittle materials followed by an in-depth look at lapping machines and equipment. Rounding out the presentation, the final chapters discuss polishing technologies and equipment as well as the latest on chemical-mechanical polishing (CMP) and its applications in the semiconductor industry. Offering an integrated approach to both theory and practical applications under a single cover, the Handbook of Lapping and Polishing supplies a definitive survey of the most advanced surface finishing technologies available.

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